Planning AI infrastructure? Don't let cooling become your bottleneck

AI workloads and high-performance computing are driving unprecedented power demands in data centers, with GPU thermal design power levels exceeding 1000 watts. Traditional air cooling methods are reaching their limits, creating challenges that risk bottlenecking AI infrastructure investments.

This white paper explores direct-to-chip liquid cooling as the solution for managing extreme heat loads. It provides guidance on deployment, covering:

· Identifying cooling capacity gaps to avoid delays
· Using coolant distribution units to manage thermal loads
· Planning for hybrid environments with liquid and air cooling

Navigate the shift to liquid-cooled AI infrastructure confidently.